VILATI CIRCUITS KFT

VILATI CIRCUITS
Nyomtatott Áramkör Gyártó Kft.

Eger, Faiskola u. 9
H-3301 Eger, Pf.3
Phone.: +36 36 411 077
Fax: +36 36 412 556
Mod.: +36 36 411 902
email:vicid@mail.datanet.hu

VILATI CIRCUITS KFT was established in 1993 as producer of small and middle sized series of printed circuits boards. Our production is exported for over 80 % to the Benelux and German market. Vilati Circuits estabilished his position on the Western market by focusing on reliability of the product and flexibility in fulfilling the customers needs. Therefor we count on the expertise of our Belgian partners, Circuits NV and Europrint, a printed circuits sales organization for the Benelux. Vilati Circuits inherited from Vilati-Automatika a facility with up-to-date production equipment and a staff with over 20 years of experience in printed circuit production.

The quality of product is guaranteed by:

Ongoing efforts to motivate people to work quality-minded,
up-to-date and well maintained production equipment,,
establishment of a quality system based on ISO 9002.

We offer:

single sided, double sided PTH and multilayer printed circuit boards
conventional as well as a SMD technology
various platings, such as H.A.I., Reflow and Gold flash (Chemical Ni/Au)
outline milling or scoring (V-cut)
electrical test (by comparsion or againts digital inf.)
front-end with multiple editing and DRC possibilities connected to a laser plotter.
liquid photoimageable solder mask by curtain coating

Vilati Circuits shows the way in

best service anrl reliability,
best quality,
best price.

Contact us today with your price inquires or any other question.

We are here to help.

Technological possibilities

Layers one, double sided and multilayers

Wire/gap width min. 0.15 mm

Solder eye diameter hole diameter + 0.3 mm

Plated hole diameter min. to 0.3 mm

Largest panel size 450 X 550 mm

Documentation required from customer: - digital information: Gerber files ( on floppy or by modem ), drill file
- traditional information: films, originals or true dimension drawings

Film preparation: with laserplotter or with traditional foto-technologie

Base material FR-4,(FR-2, FR-3, CEM-1)

Thickness: 0.5; 0.8; 1.0; 1.6; 2.0; 2.4; 3.2 mm
Cu: 17,5; 35; 70 µm

Image transfer with screenprinting and dry film fotoresist

Solder resist 2 component screen printed fotosensibile lack

Peel of screen printed

Text print screen printed

Carbon lack screen printed

Plated layers Cu: 25- 30 µm
SnPb: 6- l0 µm (reflowed)
SnPb: 1- 25 µm (HAL)
chemical gold

Black oxide

Tab plating Ni: 5- 7 µm, Au: 1.5- 2 µm

Finishing routing, break routing, V-cut, cutting

Final inspection visual, electrical test

Packaging shrink foil

Elõzõ oldal

Layers	one, double sided and multilayers
Wire/gap width	min. 0.15 mm
Solder eye diameter	hole diameter + 0.3 mm
Plated hole diameter	min. to 0.3 mm
Largest panel size	450 X 550 mm
Documentation required from customer:	- digital information: Gerber files ( on floppy or by modem ), drill file - traditional information: films, originals or true dimension drawings
Film preparation:	with laserplotter or with traditional foto-technologie
Base material	FR-4,(FR-2, FR-3, CEM-1)
Thickness:	0.5; 0.8; 1.0; 1.6; 2.0; 2.4; 3.2 mm Cu: 17,5; 35; 70 µm
Image transfer	with screenprinting and dry film fotoresist
Solder resist	2 component screen printed fotosensibile lack
Peel of	screen printed
Text print	screen printed
Carbon lack	screen printed
Plated layers	Cu: 25- 30 µm SnPb: 6- l0 µm (reflowed) SnPb: 1- 25 µm (HAL) chemical gold
Black oxide
Tab plating	Ni: 5- 7 µm, Au: 1.5- 2 µm
Finishing	routing, break routing, V-cut, cutting
Final inspection	visual, electrical test
Packaging	shrink foil